Company Filing History:
Years Active: 2005-2011
Title: Innovations by Gary W. Comstock
Introduction
Gary W. Comstock, an accomplished inventor based in New Milford, CT, has made significant contributions to the field of innovation with his inventions. With a total of three patents under his name, Comstock's work primarily focuses on methods and devices that enhance operational efficiencies, particularly in the mail handling and measurement industries.
Latest Patents
One of Comstock's latest patents is for a method of measuring sheet thickness. This innovative approach involves rotating a cylindrical reference surface in a transport path and utilizing a probe to determine runout values at various positions. The method ensures accurate measurement of sheet thickness by adjusting the values based on runout discrepancies, a significant improvement in quality control processes.
Another noteworthy patent by Comstock is related to paddle and paddle support mechanisms in on-edge mail stackers. This design features a deck surface that accommodates an expanding vertical mail stack and employs a paddle to provide support. The paddle is intelligently designed with a wedge-shaped blade that enables it to slide mail easily without causing damage. Additionally, a toggle switch mechanism signals when the mail stack is full, showcasing Comstock's focus on practical solutions in mail logistics.
Career Highlights
Gary W. Comstock is currently associated with Pitney Bowes Inc., a leading company in mailing and shipping solutions. His role at the company underscores his expertise in developing systems that enhance productivity and efficiency in mail processing.
Collaborations
Throughout his career, Comstock has collaborated with talented professionals, including notable coworkers such as Nicholas R. Antonelli and Neil J. Kennedy. These partnerships have likely facilitated the exchange of innovative ideas and contributed to the advancement of their shared goals in improving mail technologies.
Conclusion
In conclusion, Gary W. Comstock stands out as an inventor dedicated to advancing technology through his numerous patents. His innovative approaches to sheet thickness measurement and mail stack support mechanisms attest to his commitment to enhancing operational efficiencies. With ongoing contributions to Pitney Bowes Inc., Comstock continues to influence the way mail processing is conducted, making him a notable figure in the realm of invention.