Company Filing History:
Years Active: 2005-2011
Title: Innovations of Gary Peng in Semiconductor Technology
Introduction
Gary Peng is a notable inventor based in San Gabriel, CA (US), recognized for his contributions to semiconductor technology. He holds a total of 3 patents that focus on enhancing the performance and reliability of semiconductor devices. His work is pivotal in addressing challenges faced during high-temperature processing steps in semiconductor fabrication.
Latest Patents
Gary Peng's latest patents include innovative methods for protecting ohmic metal contacts and the channel of semiconductor devices. One of his patents describes an encapsulation layer that safeguards these components during high-temperature processing. This encapsulation layer covers the channel and ohmic metal contacts, ensuring that they remain intact and functional. The invention provides a substrate for depositing multiple semiconductor layers, which act as the channel of the device. After applying the encapsulation layer, portions of it and the semiconductor layers are removed to allow for the deposition of ohmic metal contacts. These contacts are then annealed to reduce resistance, with the encapsulation layer preventing migration during this critical step. Another patent focuses on ohmic metal contact and channel protection specifically in GaN devices, utilizing a similar encapsulation approach to enhance device reliability.
Career Highlights
Gary Peng is currently employed at Hrl Laboratories, LLC, where he continues to innovate in the field of semiconductor technology. His work has significantly contributed to advancements in device fabrication techniques, particularly in protecting sensitive components during processing.
Collaborations
Gary collaborates with talented individuals such as Tahir Hussain and Miroslav Micovic, who share his commitment to advancing semiconductor technology.
Conclusion
Gary Peng's innovative patents and contributions to semiconductor technology demonstrate his expertise and dedication to improving device performance. His work continues to influence the field and pave the way for future advancements in semiconductor fabrication.