Kenilworth, United Kingdom

Gary M Wilkinson

This inventor holds 1 USPTO granted patent. Top assignee: Shipley Company LLC. Active years: 1988.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gary M Wilkinson. Retrieved from https://idiyas.com/inventor/gary-m-wilkinson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 1988

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1 patent (USPTO):Explore Patents

Title: Gary M Wilkinson: Innovator in Metal Plating Processes

Introduction

Gary M Wilkinson is a notable inventor based in Kenilworth, GB. He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique metal plating process.

Latest Patents

Gary holds 1 patent for his invention related to a metal plating process. This process is designed for the formation of a plated through-hole printed circuit board. It involves treating a circuit board base material in a specific manner to enhance its functionality and reliability.

Career Highlights

Gary is currently associated with Shipley Company LLC, where he applies his expertise in metal plating and circuit board technology. His work has been instrumental in advancing the capabilities of printed circuit boards in various applications.

Collaborations

Throughout his career, Gary has collaborated with talented professionals, including Cheryl A Deckert and Jeffrey J Doubrava. These collaborations have fostered innovation and contributed to the success of their projects.

Conclusion

Gary M Wilkinson's contributions to the field of metal plating processes exemplify his dedication to innovation and technology. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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