Gary Lee Hendren

This inventor holds 15 USPTO granted patents, plus 7 CIPO patents and 11 EPO patents, primarily in Honeycomb Materials. Top assignee: E.i. Dupont De Nemours and Company. Active years: 1989-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gary Lee Hendren. Retrieved from https://idiyas.com/inventor/gary-lee-hendren

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 15

% Patents Active = 100.0

CIPO Patents = 7 (Patent Applications = 4)

EPO Patents = 11 (Patent Applications = 6)

Average Co-Inventor Count = 2.4

ph-index = 5

Forward Citations = 61(Granted Patents)

Company Filing History:

15 out of 16,339

E.i. Dupont De Nemours and Company

patents

Years Active: 1989-2012

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Areas of Expertise:

Fibrids

Diamino Diphenyl Sulfone

Honeycomb

Flame Retardant

Thermoplastic Binder

Synthetic Papers

High Strength Papers

Low-Density Boards

Electrical Insulating Board

Additives Distribution

Surface Adhesion

15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8118975 - Papers containing fibrids derived from diamino diphenyl sulfone (2012-02-21),

2. 8114251 - Papers containing fibrids derived from diamino diphenyl sulfone (2012-02-14),

3. 8025949 - Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom (2011-09-27),

4. 7815993 - Honeycomb from paper having flame retardant thermoplastic binder (2010-10-19),

5. 7803247 - Papers containing floc derived from diamino diphenyl sulfone (2010-09-28),

6. 7785520 - Processes for making shaped honeycomb and honeycombs made thereby (2010-08-31),

7. 7771811 - Honeycomb from controlled porosity paper (2010-08-10),

8. 7771810 - Honeycomb from paper having a high melt point thermoplastic fiber (2010-08-10),

9. 7771809 - Shaped honeycomb (2010-08-10),

10. 5320892 - Tough layered papers with improved surface adhesion (1994-06-14),

11. 5126012 - High strength papers from floc and fibrids (1992-06-30),

12. 5089088 - Low-density, high strength aramid boards (1992-02-18),

13. 5076887 - Pressboard and process for its production (1991-12-31),

14. 4940512 - Cross-directional distribution of additives in synthetic papers (1990-07-10),

15. 4886578 - High heat resistant oil-impregnatable electrical insulating board (1989-12-12),

Title: Innovations by Gary Lee Hendren: A Pioneer in Paper Technology

Introduction

Gary Lee Hendren, an inventive mind based in Richmond, VA, holds an impressive portfolio featuring 15 patents. His innovative work primarily focuses on the development of advanced papers that exhibit enhanced properties.

Latest Patents

Among his most recent inventions is a patent for papers containing fibrids derived from diamino diphenyl sulfone. This invention relates to the creation of papers made with fibrids that incorporate a polymer or copolymer derived from specific monomers, including 4,4'-diaminodiphenyl sulfone and 3,3'-diaminodiphenyl sulfone. These papers showcase high thermal stability and a superior ability to accept ink compared to those made solely with aramid fibrids.

Career Highlights

Gary works at E.I. du Pont de Nemours and Company, a leading name in the science and technology sector. His role contributes significantly to the innovative advancements in material science, particularly in the development of high-performance papers.

Collaborations

Throughout his career, Gary has collaborated with esteemed professionals in the field, including Mikhail R. Levit and Subhotosh Khan. These partnerships have further enriched his contributions to research and development in paper technology.

Conclusion

Gary Lee Hendren stands out as a notable inventor whose work impacts various applications within the paper industry. His ongoing innovations not only elevate product quality but also establish new standards for the use of materials in practical applications. With his continued dedication, he promises to inspire future advancements in this domain.

Profile summary based on public USPTO records.