Gary L Lewis

Title: Innovations of Gary L. Lewis in Semiconductor Technology

Introduction

Gary L. Lewis is a notable inventor based in Peoria, Arizona, recognized for his contributions to semiconductor technology. With a total of three patents to his name, Lewis has made significant advancements in the field, particularly in developing moisture-resistant semiconductor devices.

Latest Patents

One of his latest patents is a method for making moisture-resistant semiconductor devices that utilize organic substrates. This innovative approach targets critical interfaces within semiconductor devices that are prone to delamination and cracking. The design includes a solid pad with a chemically created oxide layer, ensuring improved adhesion and durability. Another significant patent involves a low thermal impedance plastic package for fiber optic semiconductor devices, which enhances heat conduction through both a heat spreader and the plastic enclosure.

Career Highlights

Gary L. Lewis has spent a considerable part of his career at Motorola Corporation, where he has been instrumental in developing cutting-edge technologies. His work has not only advanced the capabilities of semiconductor devices but has also contributed to the overall efficiency and reliability of electronic components.

Collaborations

Throughout his career, Lewis has collaborated with esteemed colleagues, including Howard M. Berg and Sankaranarayanan Ganesan. These partnerships have fostered a collaborative environment that has led to innovative solutions in semiconductor technology.

Conclusion

In summary, Gary L. Lewis is a prominent inventor whose work in semiconductor technology has led to significant advancements in moisture resistance and thermal management. His contributions continue to influence the industry and pave the way for future innovations.