Motorola Corporation

Gary L Lewis

Howard M Berg

George W Hawkins

James W Sloan

Curtis W Mitchell

Scott C Bolton

Sankaranarayanan Ganesan

A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122). In practicing these operations, the following interfaces are targeted and their adhesion characteristics are improved: die attach material to die pad; die attach material to die; molding compound to die pad; and molding compound to die attach material.

Method for making a moisture resistant semiconductor device having an

A package for fiber optic semiconductor devices is disclosed in which heat is conducted by both a heat spreader and through a plastic enclosure portion of the package.

Low thermal impedance plastic package

A process is described for attaching optical fiber to a semiconductor die in which a first droplet of adhesive is applied to the die and partially gelled to form a cushion for receiving the end of the optical fiber to be attached thereto.

Growing community of inventors

Peoria, AZ, United States of America

Gary L Lewis