This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Oracle International Corporation. Active years: 2013.
Company Filing History:
Years Active: 2013
Title: Gary John Formica: Innovator in Die Power Structures
Introduction
Gary John Formica is a notable inventor based in San Jose, CA. He has made significant contributions to the field of power structures in semiconductor technology. With a total of 2 patents, Formica's work is recognized for its innovative approach to die power structures.
Latest Patents
Formica's latest patents include a unique design for a die power structure. This design features a first set of power tiles arranged in a first array with a specific voltage. Additionally, it includes a second set of power tiles arranged in a second array, offset from the first array, and having a different voltage. The structure also incorporates power mesh segments enclosed by the second set of power tiles, maintaining the first voltage. A first power rail passes underneath the set of power mesh segments and the first set of power tiles, with a set of vias connecting the power rail to the power mesh segments and the first plurality of power tiles.
Career Highlights
Gary John Formica is currently employed at Oracle International Corporation, where he continues to innovate in the field of semiconductor technology. His work has contributed to advancements in power management and efficiency in electronic devices.
Collaborations
Formica collaborates with Aparna Ramachandran, leveraging their combined expertise to drive innovation within their projects.
Conclusion
Gary John Formica's contributions to die power structures exemplify his commitment to innovation in technology. His patents reflect a deep understanding of power management in semiconductors, marking him as a significant figure in his field.