Gary F Derbenuick

Title: Innovations of Gary F Derbenuick

Introduction

Gary F Derbenuick is an accomplished inventor based in Colorado Springs, CO (US). He is known for his significant contributions to the field of integrated circuit fabrication. With a focus on innovative methods, Derbenuick has developed a unique approach that enhances the efficiency and effectiveness of integrated circuits.

Latest Patents

Derbenuick holds a patent for a method of fabricating an integrated circuit using self-patterned thin films. This innovative process involves applying a photosensitive liquid solution to a substrate, which is then patterned through exposure to radiation and development. The resulting solid material, such as SrBi.sub.2 Ta.sub.2 O.sub.9, is incorporated into integrated circuit components. The fabrication processes are designed to protect the self-patterned solid material from conventional IC processing while safeguarding conventional materials like silicon from the elements in the self-patterned solid material.

Career Highlights

Throughout his career, Gary F Derbenuick has worked with notable companies, including Symetrix Corporation and Mitsubishi Materials Corporation. His experience in these organizations has contributed to his expertise in integrated circuit technology and fabrication processes.

Collaborations

Derbenuick has collaborated with esteemed colleagues such as Hiroto Uchida and Nobuyuki Soyama. These partnerships have further enriched his work and innovations in the field of integrated circuits.

Conclusion

Gary F Derbenuick's contributions to the field of integrated circuit fabrication demonstrate his innovative spirit and dedication to advancing technology. His patent and career achievements reflect his significant impact on the industry.