Gary Ding

Title: Gary Ding - Innovator in Chemical Mechanical Polishing

Introduction

Gary Ding is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of chemical mechanical polishing (CMP) processes. His innovative approach has led to the development of a unique patent that enhances the efficiency and effectiveness of substrate polishing.

Latest Patents

Gary Ding holds a patent for a "Multi-platen multi-slurry chemical mechanical polishing process." This method involves several steps, including providing a substrate with a nitride structure and an oxide layer. The process utilizes a first platen with a silica-based slurry to remove a bulk portion of the oxide layer without exposing the nitride structure. Subsequently, a second CMP process employs a ceria-based slurry to remove the residual portion of the oxide layer, exposing the nitride structure. Finally, a third CMP process is performed using the first platen with a silica-based slurry to eliminate defects caused by the ceria-based slurry. This innovative method showcases Gary's expertise and commitment to advancing CMP technology.

Career Highlights

Gary Ding is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in semiconductor manufacturing. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, contributing to the company's reputation for cutting-edge technology.

Collaborations

Throughout his career, Gary has worked alongside talented colleagues, including Matthew J Prince and Mansour Moinpour. These collaborations have fostered an environment of creativity and innovation, leading to advancements in CMP processes.

Conclusion

Gary Ding's contributions to the field of chemical mechanical polishing are noteworthy. His patent and work at Intel Corporation exemplify his dedication to innovation and excellence in technology. His efforts continue to shape the future of semiconductor manufacturing.