Gary B Warren

Title: The Innovations of Gary B. Warren

Introduction

Gary B. Warren is a notable inventor based in Huntington Beach, CA. He has made significant contributions to the field of optoelectronics, holding a total of 5 patents. His work focuses on enhancing the functionality and efficiency of photodiodes, which are essential components in optical communication systems.

Latest Patents

One of his latest inventions is the "Front Side Illuminated Photodiode with Backside Bump." This invention relates to a novel optoelectronic chip that features one or more optoelectronic devices, such as photodiodes, fabricated on the front side of a semiconductor wafer. The contacts are located on the backside of the semiconductor wafer, utilizing contact bumps. This design allows the optoelectronic chip to benefit from flip chip packaging without needing to flip the chip upside down concerning a chip carrier. In an optical communication system, a photodiode chip can be backside bumped to a chip carrier or an electronic chip, enabling front side illumination of the photodiode chip. This front side illumination offers numerous advantages, including improved fiber alignment, reduced manufacturing time, and overall cost reduction.

Career Highlights

Throughout his career, Gary has worked with prominent companies such as Hughes Aircraft Company and Microsemi Corporation. His experience in these organizations has contributed to his expertise in the field of optoelectronics and semiconductor technology.

Collaborations

Gary has collaborated with talented individuals in his field, including Jay Jie Lai and Truc Q Vu. These collaborations have likely enriched his work and led to innovative advancements in his projects.

Conclusion

Gary B. Warren's contributions to optoelectronics and his innovative patents demonstrate his commitment to advancing technology in this field. His work continues to influence the development of efficient optical communication systems.