Gannon Reichert

Title: Gannon Reichert: Innovator in Thermal Interface Materials

Introduction

Gannon Reichert is a notable inventor based in Bethlehem, PA (US). He has made significant contributions to the field of thermal interface materials, showcasing his innovative spirit through his patented inventions.

Latest Patents

Reichert holds a patent for a thermal interface material containment system. This patent describes systems and methods for providing a bare circuit integrated circuit package with a containment ring. The design includes a substrate connected to a printed circuit board, with an integrated circuit attached to the substrate. A stiffener ring surrounds the integrated circuit and is affixed to the substrate. A heat sink is positioned on the stiffener ring, creating a space between the top of the integrated circuit and the bottom surface of the heat sink. The thermal interface material connects the integrated circuit and the heat sink, while a containment ring is strategically placed to prevent the pumping and/or displacement of the thermal interface material.

Career Highlights

Gannon Reichert is currently employed at Infinera Corporation, where he continues to develop innovative solutions in the field of integrated circuits and thermal management. His work has been instrumental in advancing technology in this area.

Collaborations

Reichert collaborates with talented individuals such as Vinh Nguyen and John William Osenbach, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Gannon Reichert's contributions to thermal interface materials highlight his role as an inventor dedicated to advancing technology. His patent and ongoing work at Infinera Corporation reflect his commitment to innovation in the field.