Taiyuan, China

Gang Dai

This inventor holds 1 USPTO granted patent. Top assignee: Taiyuan University of Technology. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gang Dai. Retrieved from https://idiyas.com/inventor/gang-dai-ovmex0p2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Biography of Inventor Gang Dai

Introduction: Gang Dai is a prominent inventor based in Taiyuan, China. He is known for his innovative contributions to the field of rolling mill technology. With a focus on enhancing the efficiency and quality of strip rolling processes, his work has garnered attention in the engineering community.

Latest Patents: Gang Dai holds a patent for an "Asynchronous rolling mill with a super large diameter ratio and sheet rolling method." This invention features a rolling mill stand, a press-down device, a balancing device, an upper roll system, and an arc-shaped plate device. The arc-shaped plate is positioned opposite the upper roll, allowing for effective cooperation in rolling strips. This technology enables the rolling of strips with a super large diameter ratio and varying speeds, significantly reducing external friction and improving strip forming quality.

Career Highlights: Gang Dai is affiliated with Taiyuan University of Technology, where he contributes to research and development in mechanical engineering. His expertise in rolling mill technology has positioned him as a key figure in advancing manufacturing processes.

Collaborations: Throughout his career, Gang Dai has collaborated with notable colleagues, including Tao Wang and Zhiqiang Li. These partnerships have fostered innovation and the sharing of knowledge within the field.

Conclusion: Gang Dai's contributions to the field of rolling mill technology exemplify his commitment to innovation and excellence. His patent and collaborative efforts continue

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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