TOULOUSE, France

Galyna Goncharova

This inventor holds 1 USPTO granted patent. Top assignees: Airbus Operations (s.a.s.), Airbus Operations Gmbh. Active years: 2025.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Galyna Goncharova: Innovator in Surface Structuring Technology

Introduction

Galyna Goncharova is a prominent inventor based in Toulouse, France. She has made significant contributions to the field of surface structuring technology, particularly in methods that enhance the bonding of components.

Latest Patents

Goncharova holds a patent for a method for surface structuring. This innovative technique involves producing a component with a surface that is suitable for plastic welding or adhesive bonding of two parts. The process begins with arranging a filler sheet made of thermoplastic material or adhesive on the first surface of a component. A structuring tool is then placed on the filler sheet, where mechanical force and heat are applied. This results in the filler sheet being attached to the component's surface, with the structuring tool partially embedded in the filler sheet. After the structuring tool is removed, a plurality of protrusions is created on the outer surface of the filler sheet. The final step involves joining the first and second components using welding techniques or adhesive bonding.

Career Highlights

Throughout her career, Galyna Goncharova has worked with notable companies, including Airbus Operations GmbH and Airbus Operations. Her experience in these organizations has allowed her to refine her skills and contribute to advancements in aerospace technology.

Collaborations

One of her notable coworkers is Alexei Vichniakov, with whom she has collaborated on various projects.

Conclusion

Galyna Goncharova's innovative work in surface structuring technology showcases her expertise and commitment to advancing engineering solutions. Her contributions are significant in enhancing the efficiency of component bonding processes.

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