This inventor holds 4 USPTO granted patents. Top assignees: Lsi Logic Corporation, Other. Active years: 1997-1998.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
3 out of 3,715 
1 out of 834,601 Years Active: 1997-1998
Title: Galen Kirkpatrick: Inventor in Semiconductor Packaging
Introduction
Galen Kirkpatrick is an inventor based in Fremont, California. His work includes inventions for sealing lids on integrated circuit packages, and he is credited with four patents.
Latest Patents
Kirkpatrick’s listed patents address high-pressure lid sealing and the precise application of force during sealant curing.
“High Pressure Lid Seal Clip Apparatus” describes a spring-biased pressure foot carried by a secondary loading jig. The jig attaches to a fabrication boat and applies a controlled load at the center of the package lid to help seal the lid to an integrated circuit package.
“Method of Centering a High Pressure Lid Seal” describes a process for positioning and using the pressure foot. Index pins on the secondary jig engage matching sockets in the fabrication boat, aligning the jig with the package. The pressure foot is then released to apply force at the center of the lid during sealant curing.
Career Highlights
Kirkpatrick’s listed professional experience includes LSI Logic Corporation. His patent work reflects a focus on semiconductor packaging and assembly processes.
Collaborations
His listed coworkers include Mirek Boruta and Sutee Vongfuangfoo.
Conclusion
Galen Kirkpatrick’s four patents include methods and apparatus for accurately applying pressure when sealing integrated circuit package lids, highlighting his contributions to semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile