Gabriel Pittelli

Title: Gabriel Pittelli: Innovator in Heat Shrink Film Technology

Introduction

Gabriel Pittelli is an accomplished inventor based in Kimberly, Wisconsin. He has made significant contributions to the field of packaging technology, particularly with his innovative work on heat shrink films. His expertise and creativity have led to the development of a unique product that addresses specific industry needs.

Latest Patents

Gabriel Pittelli holds a patent for a multi-layer low temperature shrink film. This advanced film comprises several layers, including an abuse layer made of styrene-butadiene block copolymer, a first tie layer of ethylene vinyl acetate, a gas barrier layer of polyvinylidene chloride, a second tie layer of ethylene vinyl acetate, and a sealant layer made from a metallocene-catalyzed sealant. This innovative design enhances the performance and durability of heat shrink films in various applications.

Career Highlights

Gabriel is currently employed at Coveris Flexibles US LLC, where he continues to develop and refine packaging solutions. His work at Coveris has allowed him to collaborate with industry experts and contribute to the advancement of flexible packaging technologies.

Collaborations

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Conclusion

Gabriel Pittelli's contributions to the field of heat shrink film technology exemplify his innovative spirit and dedication to improving packaging solutions. His patent reflects a significant advancement in the industry, showcasing his ability to combine materials for enhanced performance.