This inventor holds 3 USPTO granted patents. Top assignees: Gunze Limited, Gunze Kobunshi Corporation. Active years: 1994-2003.
Company Filing History:
3 out of 161 
1 out of 1 Years Active: 1994-2003
Title: The Innovations of Fusazo Wada
Introduction
Fusazo Wada is a notable inventor based in Moriyama, Japan. He has made significant contributions to the field of packaging technology, holding a total of three patents. His work focuses on improving the efficiency and functionality of shrink-wrapped packages.
Latest Patents
One of his latest patents is a shrink-wrapped package that comprises at least one article shrink-wrapped with a polyester film containing an ethylene terephthalate unit. This innovative package features a portion of sealing and cutting whose starting point has a movement distance of 10 micrometers or less. Another notable patent is a low-temperature heat shrinkable film designed specifically for labels, which enhances the usability and performance of packaging solutions.
Career Highlights
Throughout his career, Fusazo Wada has worked with prominent companies such as Gunze Limited and Gunze Kobunshi Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in packaging technology.
Collaborations
Fusazo Wada has collaborated with talented individuals in his field, including Tomohisa Okuda and Hiroyuki Tanaka. These partnerships have contributed to the advancement of his inventions and the overall progress in packaging technology.
Conclusion
Fusazo Wada's contributions to the field of packaging through his innovative patents demonstrate his expertise and commitment to improving product packaging solutions. His work continues to influence the industry and inspire future innovations.