Wako, Japan

Fumiya Hamatsu

This inventor holds 1 USPTO granted patent. Top assignees: Honda Motor Ltd., Ltd., The University of British Columbia. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fumiya Hamatsu. Retrieved from https://idiyas.com/inventor/fumiya-hamatsu-zcptlfer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Fumiya Hamatsu: Flexible Sensor and Device Innovation

Introduction

Fumiya Hamatsu is an inventor associated with Wako, Japan. His work includes a patent for a flexible capacitance sensor and related flexible electronic devices. The available information lists 1 patent.

Latest Patents

Hamatsu’s patent, “Lamination Flexible Circuit Device, Flexible Capacitance Sensor, Flexible Actuator, and Flexible Battery,” describes a capacitance sensor made from multiple laminated layers. The design places two conductive portions opposite one another, with an elastic, dielectric flexible base material between them. Conductive wiring connects the layers, enabling a flexible sensor structure with potential applications in actuators and batteries.

Career Highlights

Hamatsu’s listed professional affiliations include Honda Motor Co., Ltd., and the University of British Columbia. His patent reflects an interest in integrating conductive components with flexible materials to support adaptable electronic devices.

Collaborations

The listed coworkers associated with Hamatsu include Ryusuke Ishizaki and Takeshi Osato.

Conclusion

Fumiya Hamatsu’s patent focuses on laminated flexible circuitry and capacitance sensing, highlighting an approach to electronic devices designed to bend while maintaining functional connections.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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