This inventor holds 1 USPTO granted patent. Top assignee: Nishikawa Rubber Co., Ltd.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Fumio Harada: Innovator in Bonding Technology
Introduction
Fumio Harada is a notable inventor based in Hiroshima, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative methods and apparatuses. His work has garnered attention for its practical applications in manufacturing processes.
Latest Patents
Fumio Harada holds a patent for a "Method and apparatus for bonding extrusion-molded or die-molded pieces." This invention involves a sophisticated mechanism that includes left and right molds, a sheet material setting mechanism, and a sliding blade portion designed to cut the bonding medium. The cutting blade is uniquely shaped to align with the outer circumferential surfaces of the molded pieces, enhancing the efficiency of the bonding process.
Career Highlights
Harada is associated with Nishikawa Rubber Co., Ltd., where he has applied his expertise in developing innovative bonding solutions. His career is marked by a commitment to advancing manufacturing techniques and improving product quality through his inventions.
Collaborations
Throughout his career, Fumio Harada has collaborated with notable colleagues, including Kazuharu Konishi and Yoshihiro Masada. These partnerships have contributed to the development of cutting-edge technologies in the field.
Conclusion
Fumio Harada's contributions to bonding technology exemplify the impact of innovation in manufacturing. His patent and collaborative efforts highlight the importance of continuous improvement in industrial processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile