This inventor holds 11 USPTO granted patents. Top assignee: Rohm Co., Ltd.. Active years: 1993-1999.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1993-1999
Title: Fumiaki Tagashira: Innovator in Thermal Head Technology
Introduction
Fumiaki Tagashira is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of thermal head technology, holding a total of 11 patents. His innovative designs have advanced the efficiency and functionality of thermal printing systems.
Latest Patents
Among his latest patents is a thermal head that consists of one or more substrates. Each substrate comprises a heating element, common electrodes arranged on one side, and individual electrodes on the opposite side. The design allows for the manufacturing of multiple substrates with identical electrode patterns, simplifying wiring and ensuring a consistent data transfer direction. Another notable patent involves a thermal head with flush adjacent head substrates. This design features a base plate with holes that allow for precise placement and bonding of head substrates, ensuring that there is no level difference at the joint, even when subjected to heat expansion.
Career Highlights
Fumiaki Tagashira has dedicated his career to advancing thermal head technology. His work at Rohm Co., Ltd. has positioned him as a key figure in the development of innovative thermal printing solutions. His patents reflect a deep understanding of the technical challenges in this field and a commitment to overcoming them.
Collaborations
Throughout his career, Tagashira has collaborated with notable colleagues, including Shigeo Ota and Shingo Ooyama. These partnerships have fostered a creative environment that has led to groundbreaking advancements in thermal head technology.
Conclusion
Fumiaki Tagashira's contributions to thermal head technology have significantly impacted the industry. His innovative patents and collaborative efforts continue to shape the future of thermal printing solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
