Kuala Lumpur, Malaysia

Fumiaki Hosokoshi

USPTO Granted Patents = 1 

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Fumiaki Hosokoshi: Innovator in Surface-Treated Copper Foil Technology

Introduction

Fumiaki Hosokoshi is a notable inventor based in Kuala Lumpur, Malaysia. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. His innovative work has led to the creation of a patent that addresses critical performance issues in copper foils used in various applications.

Latest Patents

Fumiaki Hosokoshi holds a patent for a surface-treated copper foil. The objective of this invention is to provide a copper foil that exhibits excellent softening resistance performance, which minimizes the decrease in tensile strength after heat treatment at temperatures ranging from 350°C to 400°C. The patent describes a copper foil that is enhanced with a rust-proofing treatment layer on both surfaces, constituted by a zinc alloy. This treatment layer contains a specific zinc amount ranging from 20 mg/m² to 1,000 mg/m². Additionally, the copper foil incorporates small amounts of elements such as carbon, sulfur, chlorine, and nitrogen, with a total amount of 100 ppm or more.

Career Highlights

Fumiaki Hosokoshi is associated with Mitsui Mining & Smelting Company, Ltd., where he has been instrumental in advancing the company's research and development efforts in materials technology. His expertise in copper foil technology has positioned him as a key figure in the industry.

Collaborations

Fumiaki has collaborated with notable colleagues, including Shinichi Obata and Shinya Hiraoka. Their combined efforts have contributed to the successful development of innovative materials and technologies.

Conclusion

Fumiaki Hosokoshi's work in surface-treated copper foil technology exemplifies the importance of innovation in materials science. His contributions not only enhance the performance of copper foils but also pave the way for advancements in various industrial applications.

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