Tokyo, Japan

Fukuyoshi Kurosawa

This inventor holds 1 USPTO granted patent. Top assignee: Koike Sanso Kogyo Co., Ltd.. Active years: 1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fukuyoshi Kurosawa. Retrieved from https://idiyas.com/inventor/fukuyoshi-kurosawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: Fukuyoshi Kurosawa: Innovator in Frame Construction Technology

Introduction

Fukuyoshi Kurosawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of machining technology, particularly through his innovative patent related to frame construction.

Latest Patents

Kurosawa holds a patent for a "Frame construction and a machining device provided with it." This invention introduces a frame construction that consists of frames where a machining tool and functional devices are mounted on separate frames. The design allows the respective frames to operate independently, ensuring that machining accuracy is maintained regardless of the weight of the functional devices mounted on the frame.

Career Highlights

Kurosawa is associated with Koike Sanso Kogyo Co., Ltd., a company known for its advancements in cutting and welding technologies. His work has contributed to enhancing the efficiency and precision of machining processes.

Collaborations

Throughout his career, Kurosawa has collaborated with notable colleagues, including Kumeo Iida and Takehiko Karukome. These partnerships have fostered innovation and development in their respective fields.

Conclusion

Fukuyoshi Kurosawa's contributions to frame construction technology exemplify his commitment to innovation in machining. His patent reflects a significant advancement that enhances machining accuracy and operational efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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