Hamamatsu, Japan

Fujioka Teruhiko

This inventor holds 2 USPTO granted patents. Top assignee: Samsung Aerospace Industries, Ltd.. Active years: 1998-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fujioka Teruhiko. Retrieved from https://idiyas.com/inventor/fujioka-teruhiko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 1998-2001

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2 patents (USPTO):Explore Patents

Title: Innovations by Fujioka Teruhiko

Introduction

Fujioka Teruhiko is a notable inventor based in Hamamatsu, Japan. He has made significant contributions to the field of electronic parts loading devices, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

His latest patents include an electronic parts loading device that features a head unit equipped with an operating means. This device is designed for loading electronic parts onto printed circuit boards or for spreading adhesive on designated areas of the boards. The device incorporates driving means to move the operating means toward or away from the printed circuit board. Additionally, it includes measuring means to assess the distance from the head unit to the loading location, along with control means to optimize the movement of the operating means based on the measured data.

Career Highlights

Fujioka Teruhiko is currently employed at Samsung Aerospace Industries, Ltd., where he continues to develop innovative solutions in the electronics sector. His work has contributed to advancements in the efficiency and accuracy of electronic parts assembly.

Collaborations

He has collaborated with notable coworkers such as Okazaki Tadao and Maebara Yoshikazu, further enhancing the innovative environment in which he works.

Conclusion

Fujioka Teruhiko's contributions to electronic parts loading devices reflect his dedication to innovation and technology. His patents not only demonstrate his technical skills but also his commitment to improving electronic assembly processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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