This inventor holds 1 USPTO granted patent. Top assignee: National Chung Hsing University. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: The Innovative Contributions of Fuh-Sheng Shieu
Fuh-Sheng Shieu is a notable inventor based in Taichung, Taiwan. He has made significant strides in the field of materials science, particularly with his innovative work on composites. His research focuses on the development of advanced materials that can be utilized in various applications.
Latest Patents
Fuh-Sheng Shieu holds a patent for a "Composite with hollow nano-structures and application thereof." This composite features multiple one-dimensional hollow nanowires dispersed within a flexible polymer film. The unique properties of this composite include a dielectric constant of the hollow nanowires that is lower than that of the polymer film, resulting in a composite dielectric constant that lies between the two. This innovation has potential applications in electronics and materials engineering.
Career Highlights
Shieu is affiliated with National Chung Hsing University, where he contributes to research and development in materials science. His work has garnered attention for its practical applications and innovative approach to composite materials.
Collaborations
Some of his notable coworkers include Tzong-Ming Wu and Wei-Ping Dow. Their collaborative efforts have further advanced the research in the field of nanostructured materials.
Conclusion
Fuh-Sheng Shieu's contributions to the field of materials science, particularly through his patented innovations, highlight the importance of research in developing advanced composites. His work continues to inspire future innovations in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile