This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Zte Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Fugang Nie: Innovator in Thermoforming Technology
Introduction
Fugang Nie is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of flexible circuit board technology. His innovative approach has led to the development of a unique thermoforming device and method.
Latest Patents
Fugang Nie holds a patent for a "Thermoforming device and method for flexible circuit board." This invention discloses a thermoforming device that includes a first forming mechanism with a first forming portion designed to carry the flexible printed circuit board for processing. The device also features a second forming mechanism with a matching second forming portion, where at least one of the portions is equipped with a heating module for heat treatment. Additionally, the invention includes driving mechanisms that allow the two forming mechanisms to be displaced relative to each other, along with a controller to manage the process. He has 1 patent to his name.
Career Highlights
Fugang Nie is currently employed at ZTE Corporation, a leading telecommunications and information technology company. His work at ZTE has allowed him to focus on advancing technologies related to flexible circuit boards. His contributions have been instrumental in enhancing the efficiency and effectiveness of electronic devices.
Collaborations
Fugang has collaborated with notable colleagues, including Da Chen and Fengying Wang. Their teamwork has fostered an environment of innovation and creativity, leading to advancements in their respective fields.
Conclusion
Fugang Nie is a dedicated inventor whose work in thermoforming technology has made a significant impact on the industry. His innovative patent and collaboration with talented colleagues highlight his commitment to advancing technology in flexible circuit boards.