Company Filing History:
Years Active: 2023
Title: Fu-Yuan Yao: Innovator in Semiconductor Packaging
Introduction
Fu-Yuan Yao is a prominent inventor based in Hukou, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging methods. His innovative approach has led to advancements that enhance the reliability of semiconductor packages.
Latest Patents
Fu-Yuan Yao holds a patent for a "Stacked semiconductor package and packaging method thereof." This invention features a substrate, a first chip, at least one spacer, a second chip, and an encapsulation. The design allows the first and second chips to be intersecting and stacked on the substrate, with spacers providing support for the second chip. The encapsulation is designed to protect the entire assembly, enhancing adhesion and preventing delamination during reliability tests. This innovation significantly improves the reliability of stacked semiconductor packages.
Career Highlights
Fu-Yuan Yao is associated with Powertech Technology Inc., a leading company in semiconductor packaging and testing. His work has been instrumental in developing new technologies that push the boundaries of semiconductor performance and reliability.
Collaborations
He has collaborated with notable colleagues, including Yin-Huang Kung and Chia-Hung Lin, contributing to various projects that aim to advance semiconductor technology.
Conclusion
Fu-Yuan Yao's contributions to semiconductor packaging have established him as a key figure in the industry. His innovative patent reflects his commitment to enhancing the reliability of semiconductor technologies.