Lu-Chou, Taiwan

Fu-Yuan Xiao


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2008

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2 patents (USPTO):Explore Patents

Title: Innovations of Fu-Yuan Xiao in CMOS-MEMS Technology

Introduction

Fu-Yuan Xiao is a notable inventor based in Lu-Chou, Taiwan. He has made significant contributions to the field of MEMS (Micro-Electro-Mechanical Systems) technology, particularly in the development of CMOS-compatible processes. With a total of two patents to his name, his work has advanced the integration of MEMS with CMOS technology.

Latest Patents

Fu-Yuan Xiao's latest patents include a fully CMOS-compatible MEMS multi-project wafer process. This innovative process involves coating a layer of thick photoresist on a wafer surface, patterning the photoresist to define a micromachining region, and performing micromachining to form suspended microstructures. Another significant patent focuses on methods for dicing a released CMOS-MEMS multi-project wafer. This method proposes practical techniques to protect micromachined microstructures during the dicing process, utilizing a thick photoresist to cover all cavities and structures. Additionally, a laser dicing system is employed to precisely control the dicing path, enhancing the reliability of the process.

Career Highlights

Throughout his career, Fu-Yuan Xiao has worked with esteemed organizations such as the National Applied Research Laboratories and the National Chip Implementation Center. His experience in these institutions has allowed him to refine his expertise in MEMS technology and contribute to various innovative projects.

Collaborations

Fu-Yuan Xiao has collaborated with notable colleagues, including Ying-Zong Juang and Chin-Fong Chiu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Fu-Yuan Xiao's contributions to CMOS-MEMS technology demonstrate his commitment to advancing the field through innovative processes and methods. His patents reflect a deep understanding of the challenges in MEMS integration, paving the way for future advancements in this critical area of technology.

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