This inventor holds 1 USPTO granted patent. Top assignee: Auo Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: The Innovations of Fu-Wei Chan
Fu-Wei Chan is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of technology, particularly in the area of packaging structures for electronic components. His work has led to advancements that enhance the performance and reliability of light-emitting diodes.
Latest Patents
Fu-Wei Chan holds a patent for a "Package structure and manufacturing method thereof." This innovative package structure includes a circuit substrate, a light-emitting diode array, a first encapsulant, and a sealant. The circuit substrate features a top surface and a side surface, with the light-emitting diode array positioned on the top surface. The first encapsulant is strategically placed above the circuit substrate, consisting of a main portion that runs parallel to the top surface and an extension portion that extends to the side surface. The sealant is located below the extension portion, ensuring contact with both the first encapsulant and the circuit substrate. Together, the first encapsulant and the sealant create a coplanar surface, which is crucial for the functionality of the package.
Career Highlights
Fu-Wei Chan is currently employed at AUO Corporation, a leading company in the display technology industry. His role at AUO has allowed him to apply his innovative ideas and contribute to the development of advanced electronic packaging solutions. His expertise in this area has positioned him as a valuable asset to the company.
Collaborations
Fu-Wei Chan has collaborated with Kuan-Hsun Chen, a fellow inventor, to further enhance their research and development efforts. Their partnership has fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Fu-Wei Chan's contributions to the field of electronic packaging are noteworthy. His patent for a novel package structure demonstrates his commitment to advancing technology. Through his work at AUO Corporation and collaborations with other inventors, he continues to make a significant impact in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile