Tu-Chen, Taiwan

Fu-Ming Chen


Average Co-Inventor Count = 2.9

ph-index = 7

Forward Citations = 132(Granted Patents)


Company Filing History:


Years Active: 2002-2004

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26 patents (USPTO):Explore Patents

Title: Fu-Ming Chen: Innovator in Heat Dissipation Technology

Introduction: Fu-Ming Chen, a prominent inventor based in Tu-Chen, Taiwan, has made significant contributions to the field of thermal management technology. With a remarkable portfolio of 26 patents, Chen has proven himself as an innovator dedicated to enhancing the efficiency of electronic devices through effective heat dissipation solutions.

Latest Patents: Among his latest innovations is a patent for a heat dissipating assembly with an air guide device. This invention includes a heat sink attached to an electronic package and a fan mounted to the heat sink. Furthermore, the air guide device incorporates a duct that is securely fixed to a computer enclosure at an air opening, along with an adjustably connected hood. The design features annular grooves on the duct's outer surface, which function to retain the hood in place while ensuring that heated air blown by the fan is efficiently channeled out of the enclosure.

Career Highlights: Fu-Ming Chen is associated with Hon Hai Precision Industry Co., Ltd., a leading company in technology and electronics manufacturing. His unique approach to solving problems related to heat dissipation has received recognition within the industry, showcasing his dedication to innovation.

Collaborations: Throughout his career, Chen has collaborated with notable colleagues, including Chieh-Nan Chien and Yin-Sheng Yeh. Their teamwork has contributed to the advancement of thermal management solutions, reinforcing the significance of collaborative efforts in the field of innovation.

Conclusion: Fu-Ming Chen's contributions as an inventor continue to pave the way for advancements in electronic device performance. With a robust patent portfolio and collaborative efforts with esteemed colleagues, Chen exemplifies the impact of innovation in addressing critical challenges in technology. His work not only showcases technical skill but also an unwavering commitment to enhancing the efficiency of modern electronics.

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