Hsinchu, Taiwan

Fu-Hung Hsu


Average Co-Inventor Count = 1.3

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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2 patents (USPTO):Explore Patents

Title: Fu-Hung Hsu: Innovator in Heat Dissipation Technologies

Introduction

Fu-Hung Hsu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic devices, particularly in heat dissipation structures. With a total of 2 patents, Hsu's work focuses on enhancing the efficiency and performance of electronic components.

Latest Patents

Hsu's latest patents include innovative designs for heat dissipation structures and electronic devices utilizing these structures. One of his patents describes an electronic device that features a heat dissipation structure comprising a first heat dissipation member made of a thermally conductive material and a second heat dissipation member positioned near an antenna. This design ensures that the second heat dissipation member covers a portion of the antenna's output surface, thereby improving thermal management. Another patent outlines a heat dissipation structure with a housing made of high thermal resistance material, which is crucial for maintaining optimal operating temperatures in electronic apparatuses.

Career Highlights

Fu-Hung Hsu is currently employed at Alpha Networks Inc., where he continues to develop cutting-edge technologies in the realm of electronic devices. His expertise in thermal management has positioned him as a key player in the industry, contributing to advancements that enhance device performance and reliability.

Collaborations

Hsu collaborates with fellow inventor Hsin-Hong Chen, working together to push the boundaries of innovation in their field. Their combined efforts have led to the development of technologies that address critical challenges in electronic device design.

Conclusion

Fu-Hung Hsu's contributions to heat dissipation technologies are invaluable in the ever-evolving landscape of electronic devices. His innovative patents and collaborative efforts continue to shape the future of thermal management in electronics.

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