Alpha Networks Inc.

Fu-Hung Hsu

Hsin-Hong Chen

An electronic device includes a heat dissipation structure including a first heat dissipation member and a second heat dissipation member. The first heat dissipation member is disposed on a circuit board and is made of a thermally conductive material. The second heat dissipation member is disposed close to an antenna. A projection of the second heat dissipation member on an output surface of the antenna at least covers a portion of the output surface of the antenna. The second heat dissipation member is in contact with the first heat dissipation member. The second heat dissipation member is made of a plastic material mixed with a plurality of ceramic particles.

Heat dissipation structure and electronic device using same

A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m&#xb7;K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.

Growing community of inventors

Hsinchu, Taiwan

Fu-Hung Hsu