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For the Inventor, By the Inventor

Herrenberg, Germany

Friedrich W Schwerdt

This inventor holds 10 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1977-1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Friedrich W Schwerdt. Retrieved from https://idiyas.com/inventor/friedrich-w-schwerdt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 7

Forward Citations = 158(Granted Patents)


Location History:

  • Burgwedel, DE (1977)
  • Boeblingen, DE (1977)
  • Sindelfingen, DE (1978 - 1979)
  • Herrenberg, DE (1985 - 1989)

Company Filing History:

goldMedal10 out of 166,409 
 
International Business Machines Corporation
 patents

Years Active: 1977-1989

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10 patents (USPTO):Explore Patents
1. 4857383 - Synthetic substrate with adhesive metal layer (1989-08-15),
2. 4705592 - Process for producing printed circuits (1987-11-10),
3. 4642163 - Method of making adhesive metal layers on substrates of synthetic (1987-02-10),
4. 4556628 - Process for producing printed circuit boards with metallic conductor (1985-12-03),
5. 4540464 - Method of renewing defective copper conductors on the external planes of (1985-09-10),
6. 4521280 - Method of making printed circuits with one conductor plane (1985-06-04),
7. 4152195 - Method of improving the adherence of metallic conductive lines on (1979-05-01),
8. 4117093 - Method of making an amorphous silicon dioxide free of metal ions (1978-09-26),
9. 4039371 - Etchant for polyimides (1977-08-02),
10. T954010 - Method of coating oxidized inorganic substrates with polyimide (1977-01-03),

Title: Friedrich W Schwerdt: Innovator in Synthetic Substrates and Printed Circuits

Introduction

Friedrich W Schwerdt is a notable inventor based in Herrenberg, Germany. He has made significant contributions to the fields of synthetic substrates and printed circuit technology. With a total of 10 patents to his name, Schwerdt's work has had a lasting impact on the industry.

Latest Patents

One of Schwerdt's latest patents is for a synthetic substrate with an adhesive metal layer. This innovative method improves the adhesion between synthetic substrates and metallized layers. The process involves spin-coating a glass resin layer onto an epoxide substrate, followed by the application of a photoresist layer that is roughened through reactive ion etching. This technique creates a perforation pattern in the glass layer, allowing for enhanced adhesion properties.

Another significant patent involves a process for producing printed circuits. This method includes a dry substrate activation process and copper deposition without the need for electroless plating. It is designed to be more efficient and environmentally friendly than traditional methods. The process begins with the lamination of sacrificial copper layers to a prepreg substrate, followed by drilling through holes. After the sacrificial layer is removed, copper is sputter deposited, and the desired circuit patterns are created through electroplating.

Career Highlights

Friedrich W Schwerdt is currently associated with International Business Machines Corporation (IBM). His work at IBM has allowed him to explore and develop innovative technologies that push the boundaries of current practices in the field.

Collaborations

Throughout his career, Schwerdt has collaborated with notable colleagues, including Johann Greschner and Dieter K Bahrle. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Friedrich W Schwerdt is a distinguished inventor whose contributions to synthetic substrates and printed circuits have significantly influenced the industry. His innovative patents and collaborations reflect his commitment to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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