Schwelm, Germany

Friedrich-Ludwig Siever

This inventor holds 2 USPTO granted patents. Top assignee: Herberts Gesellschaft MIT Beschrankter Haftung. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Friedrich-Ludwig Siever. Retrieved from https://idiyas.com/inventor/friedrich-ludwig-siever

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 1999

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2 patents (USPTO):Explore Patents

Title: Friedrich-Ludwig Siever: Innovator in Multilayer Lacquering Processes

Introduction

Friedrich-Ludwig Siever is a notable inventor based in Schwelm, Germany. He has made significant contributions to the field of multilayer lacquering processes. With a total of 2 patents to his name, Siever has established himself as a key figure in his industry.

Latest Patents

One of his latest patents focuses on a multilayer lacquering process, which showcases his innovative approach to enhancing the quality and durability of lacquered surfaces. This advancement is crucial for various applications in manufacturing and design.

Career Highlights

Friedrich-Ludwig Siever is currently associated with Herberts Gesellschaft mit beschränkter Haftung, where he continues to develop and refine his inventions. His work has had a lasting impact on the industry, particularly in improving the efficiency and effectiveness of lacquering techniques.

Collaborations

Throughout his career, Siever has collaborated with esteemed colleagues such as Joachim Blum and Dieter Stranghoner. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Friedrich-Ludwig Siever's contributions to multilayer lacquering processes highlight his innovative spirit and dedication to improving industrial practices. His work continues to influence the industry and inspire future inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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