Waldkirch, Germany

Friedrich Esselborn



Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Friedrich Esselborn: Innovator in Sensor Technology

Introduction

Friedrich Esselborn is a notable inventor based in Waldkirch, Germany. He has made significant contributions to the field of sensor technology, particularly through his innovative designs and patents. His work has had a considerable impact on the way sensors are integrated into various systems.

Latest Patents

Friedrich Esselborn holds a patent for a "Connection module for sensors." This connector module is designed for the connection of a sensor, such as an optoelectronic sensor, to a fieldbus. The module features a sensor interface for connecting to the sensor's interface, a bus interface for connecting to a fieldbus, and a circuit for data exchange. This circuit is capable of receiving data from the sensor interface, converting it according to its format, and outputting the converted data at the bus interface. Additionally, the circuit includes a memory for the intermediate storage of a sensor-specific control file, allowing the connector module to emulate the behavior of the connected sensor with respect to the fieldbus.

Career Highlights

Friedrich Esselborn is currently employed at Sick AG, a company renowned for its expertise in sensor solutions. His role at Sick AG has allowed him to further develop his innovative ideas and contribute to the advancement of sensor technology.

Collaborations

Throughout his career, Friedrich has collaborated with talented individuals such as Roland Gehring and Matthias Singler. These collaborations have fostered a creative environment that has led to the development of cutting-edge technologies in the field.

Conclusion

Friedrich Esselborn's contributions to sensor technology through his patent and work at Sick AG highlight his role as an influential inventor. His innovative designs continue to shape the future of sensor integration in various applications.

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