Andover, United Kingdom

Friedrich D Esch

This inventor holds 2 USPTO granted patents. Top assignee: Amf Gmbh. Active years: 1987.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Friedrich D Esch. Retrieved from https://idiyas.com/inventor/friedrich-d-esch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 1987

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2 patents (USPTO):Explore Patents

Title: Friedrich D Esch: Innovator in Packaging Technology

Introduction

Friedrich D Esch is a notable inventor based in Andover, GB. He has made significant contributions to the field of packaging technology, holding a total of 2 patents. His work has been instrumental in advancing the efficiency and effectiveness of packaging machines.

Latest Patents

Friedrich's latest patents include a bag filling apparatus, which showcases his innovative approach to packaging solutions. This invention is designed to enhance the speed and accuracy of filling bags, making it a valuable asset in the packaging industry.

Career Highlights

Friedrich D Esch is currently employed at AMF GmbH, where he continues to develop and refine packaging technologies. His expertise in this area has positioned him as a key player in the industry, contributing to the company's reputation for quality and innovation.

Collaborations

Friedrich has collaborated with John G Price, another talented individual in the field. Their partnership has led to advancements in packaging solutions, further enhancing the capabilities of AMF GmbH.

Conclusion

Friedrich D Esch is a distinguished inventor whose work in packaging technology has made a lasting impact. His contributions, particularly in the development of bag filling apparatuses, highlight his commitment to innovation in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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