Clinton, IA, United States of America

Frederic Hilaire LePrevost, Jr


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: The Innovations of Frederic Hilaire LePrevost, Jr.

Introduction

Frederic Hilaire LePrevost, Jr. is an accomplished inventor based in Clinton, Iowa. He is known for his innovative contributions to the field of soldering technology, particularly in the development of solder fillers for aluminum body parts. His work has significant implications for industries that rely on aluminum components, such as automotive manufacturing.

Latest Patents

LePrevost holds a patent for "Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same." This patent outlines a method that includes applying a paste-like fluxing agent to an aluminum body part, heating the fluxing agent to deoxidize the surface, and then applying a solder filler. The solder filler is heated to bond it to the aluminum body part, with a melting point at least 100 degrees Celsius lower than that of the aluminum. The patent also describes a filler/flux mixture that can be applied and heated to achieve the same bonding effect. The solder fillers include various tin-based alloys and zinc-based solder filler alloys.

Career Highlights

Throughout his career, LePrevost has worked with notable companies, including Ford Motor Company Limited and Johnson Manufacturing Company. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in soldering technology.

Collaborations

LePrevost has collaborated with professionals such as Nigel Frederick Clay and Tsung-Yu Pan. These collaborations have likely enriched his work and contributed to the development of innovative solutions in his field.

Conclusion

Frederic Hilaire LePrevost, Jr. is a notable inventor whose work in soldering technology has made a lasting impact on the industry. His patent for tin-and zinc-based solder fillers demonstrates his commitment to innovation and problem-solving in manufacturing processes.

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