The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Apr. 09, 2002
Nigel Frederick Clay, Ann Arbor, MI (US);
Tsung-yu Pan, Ypsilanti, MI (US);
Alan Edward Gickler, Clinton, IA (US);
Frederic Hilaire Leprevost, Jr., Clinton, IA (US);
Nigel Frederick Clay, Ann Arbor, MI (US);
Tsung-Yu Pan, Ypsilanti, MI (US);
Alan Edward Gickler, Clinton, IA (US);
Frederic Hilaire LePrevost, Jr., Clinton, IA (US);
Ford Motor Company, Dearborn, MI (US);
Johnson Manufacturing Company, Princeton, IA (US);
Abstract
One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 degrees C. lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.