Company Filing History:
Years Active: 2021
Title: The Innovative Mind of Franz Tinauer
Introduction
Franz Tinauer, a talented inventor based in Deutschlandsberg, Austria, has made notable contributions to the field of technology and integrated devices. With one patent to his name, Tinauer's work highlights his innovative approach to packaging technology, particularly in creating efficient substrates that enhance device performance.
Latest Patents
Franz Tinauer's sole patent involves a "Package comprising a substrate that includes a stress buffer layer." This invention features a sophisticated design that integrates an embedded device with a substrate and an encapsulation layer. The encapsulation protects the integrated device, while the substrate comprises a dielectric layer, multiple interconnects, a buffer dielectric layer, and a buffer interconnect that collectively enhance the performance and robustness of the package.
Career Highlights
Currently employed at Qualcomm Incorporated, Tinauer has positioned himself as a key contributor in the realm of advanced technology. His work is pivotal in developing innovative packaging solutions, which are essential for the functionality of modern integrated devices in various applications.
Collaborations
Franz Tinauer collaborates with skilled professionals, including his coworkers Sebastian Brunner and Kurt Wiesbauer. Their collective efforts foster a creative environment that stimulates innovation and drives breakthroughs within their projects at Qualcomm.
Conclusion
Franz Tinauer's commitment to innovation is evident in his patent developments and collaborative work in the technology sector. As he continues to evolve and expand his contributions to integrated device packaging, Tinauer stands as a testament to the importance of ingenuity and teamwork in advancing technology. His achievements reflect a promising future in a field that continues to shape our digital landscape.