Frank Schliep

Title: Frank Schliep: Innovator in Flexible Printed Circuit Technology

Introduction

Frank Schliep is a notable inventor based in Bochum, Germany. He has made significant contributions to the field of flexible printed circuits (FPCs). His innovative approach has led to the development of a method and device that enhances the connection of multiple FPCs.

Latest Patents

Frank Schliep holds a patent for a "Method and device for connecting FPCs." This invention involves a method of connecting a plurality of flexible printed circuits, each comprising a layer of electrically insulating material and a layer of electrically conducting material. The method includes forming a hole through each flexible printed circuit, positioning first and second substantially rigid plates of electrically insulating material on either side of the flexible printed circuits, and extending a rivet of electrically conducting material through the aligned holes to create an improved electrical and mechanical connection between the FPCs.

Career Highlights

Frank Schliep is currently employed at Delphi Technologies, Inc., where he continues to innovate in the field of electronic components. His work focuses on enhancing the reliability and efficiency of flexible printed circuits, which are essential in various electronic applications.

Collaborations

Throughout his career, Frank has collaborated with talented individuals such as Tarik Gunay and Wulf Bramesfeld. These collaborations have contributed to the advancement of technology in the field of flexible printed circuits.

Conclusion

Frank Schliep's contributions to the field of flexible printed circuits demonstrate his commitment to innovation and excellence. His patented method for connecting FPCs represents a significant advancement in the industry.