Dohna, Germany

Frank Herrmann

This inventor holds 6 USPTO granted patents and 1 published patent application and 4 EPO patents. Top assignee: Heimann Sensor Gmbh. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Frank Herrmann. Retrieved from https://idiyas.com/inventor/frank-herrmann-jub51fn4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 83.3

 

Average Co-Inventor Count = 7.0

ph-index = 3

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2013-2024

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6 patents (USPTO):Explore Patents

Title: Inventor Frank Herrmann: A Pioneer in Thermal Infrared Sensor Technology

Introduction

Frank Herrmann, based in Dohna, Germany, is an accomplished inventor with a remarkable portfolio of six patents. His groundbreaking work in the field of thermal infrared sensors has significantly contributed to advancements in sensor technologies, paving the way for innovative applications in various industries.

Latest Patents

Among Frank Herrmann's latest inventions are several patents that showcase his expertise and innovative spirit. The first patent details a method for producing a thermal infrared sensor array in a vacuum-filled wafer-level housing. This cutting-edge methodology allows for the creation of extremely compact sensor arrays composed of at least two wafers, including a cover wafer and a central wafer, featuring multiple infrared-sensitive sensor pixels on a thin slotted membrane positioned over a heat-insulating cavity.

Another notable patent focuses on the production of a high-resolution monolithic silicon micromechanical thermopile array sensor. Utilizing wafer-level packaging technology, this sensor achieves high spatial resolution with a minimal overall thickness, facilitating cost-effective production using standard CMOS processes. The inventive process involves rigidly connecting the cover wafer to the central wafer containing the sensor pixels through wafer bonding, followed by thinning out the central wafer to a specified thickness.

Additionally, Herrmann has contributed to the development of an SMD-enabled infrared thermopile sensor. This compact sensor includes miniaturized thermopile pixels integrated into a hermetically sealed housing made from a non-metallic substrate. Notably, the sensor design incorporates an aperture opening in the housing cover that focuses radiation onto the thermopile pixels, resulting in an overall housing height of less than 3 mm or even 2.5 mm.

Career Highlights

Frank Herrmann is associated with Heimann Sensor GmbH, a company that specializes in innovative sensor technologies. His work at the organization has established him as a leading figure in the thermal infrared sensor domain. With his commitment to pushing the boundaries of sensor technology, Herrmann continues to garner recognition within the field of inventors.

Collaborations

Throughout his career, Frank Herrmann has collaborated with other skilled professionals, including Marion Simon and Wilhelm Leneke. Together, they have contributed to the advancement of sensor technologies, sharing insights and expertise that drive innovation in their respective disciplines.

Conclusion

As a prominent inventor in the field of thermal infrared sensors, Frank Herrmann's contributions reflect a dedication to innovation and excellence. With a strong foundation of patents to his name and collaborations with talented colleagues, Herrmann continues to influence the future of sensor technology, making strides that will benefit various applications across different industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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