This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1986.
Company Filing History:
Years Active: 1986
Title: Frank H Dacol: Innovator in Thermal Wave Microscopy
Introduction
Frank H Dacol is a notable inventor based in White Plains, NY (US). He has made significant contributions to the field of thermal imaging technology. His innovative approach has led to the development of a unique non-contact thermal imaging system.
Latest Patents
Dacol holds a patent for "Thermal wave microscopy using areal infrared detection." This invention describes a non-contact thermal imaging system that utilizes infrared radiation detection. The system employs an energy source to generate a beam of energy that strikes a sample for analysis. The thermal wave produced in the sample emits infrared radiation, which is collected and directed to an infrared detector. This process allows for the creation of a two-dimensional image of the sample, enabling the detection of surface and sub-surface structures and defects. The use of a focused energy beam, such as a laser or electron beam, enhances the technique by treating all points of the sample equally, making the results easy to interpret.
Career Highlights
Frank H Dacol is associated with the International Business Machines Corporation (IBM). His work at IBM has been pivotal in advancing thermal imaging technologies. Dacol's innovative contributions have positioned him as a key figure in the field.
Collaborations
Throughout his career, Dacol has collaborated with notable colleagues, including Thomas Baumann and Robert Lee Melcher. These collaborations have further enriched his work and contributed to the success of his inventions.
Conclusion
Frank H Dacol's contributions to thermal wave microscopy exemplify the impact of innovation in technology. His patent for a non-contact thermal imaging system showcases his expertise and commitment to advancing scientific understanding. Dacol's work continues to influence the field and inspire future innovations.
