Wooster, OH, United States of America

Frank G Wilkinson

This inventor holds 1 USPTO granted patent. Top assignee: Kpc-Master's Craft International, Inc.. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Frank G Wilkinson. Retrieved from https://idiyas.com/inventor/frank-g-wilkinson-vdngmyc8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Frank G. Wilkinson: Innovator in Shrink Packaging Technology

Introduction

Frank G. Wilkinson is a notable inventor based in Wooster, OH (US). He has made significant contributions to the field of packaging technology, particularly with his innovative approach to shrink packaging systems. His work has paved the way for advancements in how products are packaged and presented in the market.

Latest Patents

Wilkinson holds a patent for a "Method and apparatus for making shrink package." This patent describes a system designed to create shrink packaging that effectively secures articles for transport and display. The system includes a conveyor that moves a rigid substrate pallet beneath a flexible wrapping feed, allowing for efficient packaging processes.

Career Highlights

Wilkinson is associated with KPC-Master's Craft International, Inc., where he has applied his expertise in packaging technology. His innovative methods have contributed to the company's reputation for quality and efficiency in packaging solutions.

Conclusion

Frank G. Wilkinson's contributions to shrink packaging technology demonstrate his commitment to innovation in the field. His patent reflects a significant advancement that benefits various industries by improving packaging methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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