Hildesheim, Germany

Frank-Dieter Hauschild


Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1998-2001

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3 patents (USPTO):Explore Patents

Title: Frank-Dieter Hauschild: Innovator in Electronic Component Assembly

Introduction

Frank-Dieter Hauschild is a notable inventor based in Hildesheim, Germany. He has made significant contributions to the field of electronic component assembly, holding a total of 3 patents. His work focuses on innovative processes that enhance the efficiency and reliability of electronic connections.

Latest Patents

One of his latest patents is a process for producing wire connections on an electronic component assembly carrier. This process involves connecting electronic components on an assembly carrier with conductor paths by welding a first ball-shaped end of a first wire to the electronic component. Additionally, a first ball-shaped end of a second wire is welded to the conductor path, and second broadened ends of both wires are welded to a connection surface located between the electronic component and the conductor path. Another significant patent he holds is for an anisotropically conducting adhesive, which further showcases his innovative approach to electronic assembly.

Career Highlights

Frank-Dieter Hauschild has had a distinguished career at Robert Bosch GmbH, where he has been instrumental in developing advanced technologies for electronic components. His expertise and innovative mindset have led to the successful implementation of various projects that have improved product performance and reliability.

Collaborations

Throughout his career, Hauschild has collaborated with notable colleagues, including Werner Gruenwald and Ralf Haug. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Frank-Dieter Hauschild's contributions to the field of electronic component assembly are significant and impactful. His innovative patents and collaborative efforts continue to shape the future of technology in this domain.

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