This inventor holds 2 USPTO granted patents. Top assignee: Augat Inc.. Active years: 1982-1985.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1982-1985
Title: Frank C Rydwansky, Jr: Innovator in Electronic Socket Technology
Introduction
Frank C Rydwansky, Jr. is a notable inventor based in Quincy, MA (US). He has made significant contributions to the field of electronic components, particularly in the design of innovative sockets for electronic devices. With a total of 2 patents, Rydwansky has demonstrated his expertise and creativity in developing solutions that enhance electronic connectivity.
Latest Patents
Rydwansky's latest patents include two groundbreaking inventions. The first is an "Electronic socket having spring probe contacts." This invention features an electronic component socket designed for both leadless and leaded electronic component packages. The socket clamps the package securely while ensuring positive electrical contact through spring-loaded probes. The design incorporates a body of electrically insulative material with an array of parallel passages that align with the electrical contact areas of the component. Each passage contains a spring probe assembly that facilitates reliable connections.
The second patent is for a "Carrier socket for leadless integrated circuit devices." This invention provides a carrier socket specifically for leadless chip integrated circuit devices. It includes a flat leadless substrate with a circuit chip positioned within a housing that contains spring-loaded contacts. These contacts engage the contact pads on the substrate, ensuring a robust electrical connection. The resilient cover holds the substrate against the contacts, allowing for secure integration with circuit boards.
Career Highlights
Frank C Rydwansky, Jr. is associated with Augat Inc., where he has contributed to the advancement of electronic component technology. His work has been instrumental in developing innovative solutions that address the challenges faced in electronic connectivity.
Collaborations
Rydwansky has collaborated with notable coworkers, including Neil F Damon and Michael Kirkman. Their combined expertise has likely contributed to the successful development of Rydwansky's patents and innovations.
Conclusion
Frank C Rydwansky, Jr. is a distinguished inventor whose work in electronic socket technology has paved the way for advancements in the field. His patents reflect a commitment to innovation and problem-solving in electronic connectivity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile