Frank Berauer

Title: Frank Berauer: Innovator in Semiconductor Technology

Introduction

Frank Berauer is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to solving complex engineering challenges.

Latest Patents

One of Frank Berauer's latest patents is titled "Solder on a Sloped Surface." This patent describes a method for depositing a solder layer or solder bump on a sloped surface. The method involves etching a sloped surface on a planar semiconductor substrate, depositing a solder-wettable layer on the sloped surface, masking the wettable layer with a coating layer to control the position of the solder deposition, and using an organic film to prevent the solder from being deposited at regions not above either the wettable layer or the coating layer. Additionally, it includes a semiconductor device structure on which a solder layer or solder bump is formed exclusively on a sloped surface.

Career Highlights

Frank Berauer is currently employed at Hewlett-Packard Development Company, L.P., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing methods that enhance the efficiency and effectiveness of solder deposition processes.

Collaborations

Frank collaborates with Hubert A Vander Plas, leveraging their combined expertise to drive innovation in their projects.

Conclusion

Frank Berauer's contributions to semiconductor technology through his patents and work at Hewlett-Packard Development Company, L.P. highlight his role as a key innovator in the field. His methods for solder deposition on sloped surfaces represent significant advancements that could influence future developments in semiconductor manufacturing.