Company Filing History:
Years Active: 2005-2008
Title: Frands Nielsen: Innovator in Chemical Mechanical Polishing
Introduction
Frands Nielsen is a notable inventor based in Havre de Grace, MD (US). He has made significant contributions to the field of chemical mechanical polishing, particularly in the development of innovative abrasives for electronic components. With a total of 2 patents, his work has advanced the technology used in the semiconductor industry.
Latest Patents
Nielsen's latest patents focus on the formulation of an aqueous chemical mechanical polishing slurry. This slurry comprises precipitated amorphous silica abrasive particles treated with acidic aluminum. The method he developed involves polishing an electronic component substrate that has an insulating film and an interconnection pattern. The process includes obtaining the substrate and polishing the interconnection material until the surface of the insulating film is exposed. This innovative approach enhances the efficiency and effectiveness of the polishing process in semiconductor manufacturing.
Career Highlights
Frands Nielsen is associated with J.M. Huber Corporation, where he applies his expertise in materials science and engineering. His work has been instrumental in improving the quality and performance of polishing slurries used in the production of electronic components. His contributions have been recognized within the industry, showcasing his commitment to innovation and excellence.
Collaborations
Nielsen has collaborated with Duen-Wu Hua, further enhancing the research and development efforts in the field of chemical mechanical polishing. Their combined expertise has led to advancements that benefit the semiconductor manufacturing process.
Conclusion
Frands Nielsen's innovative work in chemical mechanical polishing has made a significant impact on the semiconductor industry. His patents and collaborations reflect his dedication to advancing technology and improving manufacturing processes. His contributions continue to shape the future of electronic component production.