The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7455791 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 25, 2008

Filed:

Dec. 14, 2004
Applicants:

Duen-wu Hua, Edgewood, MD (US);

Frands Nielsen, Havre de Grace, MD (US);

Inventors:

Duen-Wu Hua, Edgewood, MD (US);

Frands Nielsen, Havre de Grace, MD (US);

Assignee:

J.M. Huber Corporation, Edison, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

An aqueous chemical mechanical polishing slurry is provided that comprises precipitated amorphous silica abrasive particles treated with acidic aluminum. Also provided is a method of polishing an electronic component substrate comprising the steps of: a) obtaining an electronic component substrate, the electronic component substrate having an insulating film deposited over it, an interconnection pattern formed in the insulating film, and interconnection material deposited on the insulated film and in the interconnection pattern; and b) polishing the interconnection material until a surface of said insulating film is exposed by using an aqueous chemical mechanical polishing slurry comprising: precipitated amorphous silica abrasive particles treated with acidic aluminum.


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Hua, Duen-Wu. (2008). Abrasives for copper cmp and methods for making (U.S. Patent No. 7455791). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7455791

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