Company Filing History:
Years Active: 2016-2019
Title: The Innovations of Franciscus Henrikus Martinus Swartjes
Introduction
Franciscus Henrikus Martinus Swartjes is a notable inventor based in Eindhoven, Netherlands. He has made significant contributions to the field of technology, particularly in the area of wafer level chip scale package (WLCSP) devices. With a total of 3 patents to his name, Swartjes continues to push the boundaries of innovation.
Latest Patents
One of his latest patents focuses on the reduction of defects in wafer level chip scale package (WLCSP) devices. In this invention, a wafer substrate undergoes processing where a resilient material is applied to both the front-side and back-side surfaces. By defining trenches in saw lanes between active device die, additional resilient material can be placed in these areas. After the active device die are separated into individual product devices, the resulting product device features coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface includes exposed contact areas, allowing the product device to be attached to an end user's system circuit board. Furthermore, the resilient coating serves to protect the encapsulated active device die from damage during assembly.
Career Highlights
Swartjes is currently employed at NXP B.V., a company known for its innovative solutions in the semiconductor industry. His work has been instrumental in advancing the technology behind WLCSP devices, contributing to the efficiency and reliability of electronic components.
Collaborations
Throughout his career, Swartjes has collaborated with several talented individuals, including Tonny Kamphuis and Leonardus Antonius Elisabeth Van Gemert. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Franciscus Henrikus Martinus Swartjes is a prominent figure in the field of technology, with a focus on improving wafer level chip scale package devices. His innovative patents and collaborations highlight his commitment to advancing the industry. His contributions continue to shape the future of electronic components.