The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Mar. 06, 2017
Nxp B.v., Eindhoven, NL;
Tonny Kamphuis, Nijmegen, NL;
Leonardus Antonius Elisabeth van Gemert, Nijmegen, NL;
Roelf Anco Jacob Groenhuis, Nijmegen, NL;
Caroline Catharina Maria Beelen-Hendrikx, Nijmegen, NL;
Jetse de Witte, Nijmegen, NL;
Franciscus Henrikus Martinus Swartjes, Eindhoven, NL;
NXP B.V., Eindhoven, NL;
Abstract
Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.