Floyd R Moser

Title: Floyd R. Moser: Innovator in Electronic Module Sealing

Introduction

Floyd R. Moser is a notable inventor based in South Burlington, Vermont. He has made significant contributions to the field of electronics, particularly in the packaging of electronic modules. His innovative approach has led to the development of a unique method that enhances the reliability and efficiency of electronic components.

Latest Patents

Moser holds a patent for a "Method of sealing an electronic module in a cap." This patent describes a process for packaging an electronic module that includes one or more silicon chips mounted on a substrate. The chips are sealed onto the substrate using a silicone polymer and are supported on a cap with the chips oriented inwardly. The method involves dispensing epoxy on the back surface of the substrate, allowing it to flow and bridge the gap between the substrate and cap. The epoxy is then cured through a carefully controlled heating process, ensuring optimal viscosity and stability.

Career Highlights

Floyd R. Moser is associated with the International Business Machines Corporation (IBM), where he has contributed to various projects and innovations. His work has been instrumental in advancing the technology used in electronic packaging, making it more efficient and reliable.

Collaborations

Moser has collaborated with Richard W. Noth, working together to enhance the development of electronic module sealing techniques. Their partnership has fostered innovation and improved the quality of electronic components.

Conclusion

Floyd R. Moser's contributions to the field of electronics, particularly through his patented method of sealing electronic modules, demonstrate his innovative spirit and dedication to advancing technology. His work continues to influence the industry and improve the reliability of electronic devices.