This inventor holds 1 USPTO granted patent and 2 published patent applications and 2 EPO patents. Top assignee: Infineon Technologies Ag. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Florian Eacock: Innovator in Ultrasonic Bonding Technology
Introduction
Florian Eacock is a notable inventor based in Paderborn, Germany. He has made significant contributions to the field of ultrasonic bonding technology. His innovative approach has led to the development of a unique method that enhances the calibration of bonding machines.
Latest Patents
Florian Eacock holds a patent for a "Method for calibrating an ultrasonic bonding machine." This patent describes a method for calibrating a second bonding machine based on a calibrated first bonding machine. The first bonding machine includes a first ultrasonic transducer, while the second bonding machine features a second ultrasonic transducer and a power supply. The method involves providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a specific calibration amplitude when damped by mechanical damping. Additionally, it includes providing a second electrical calibration supply that ensures the second ultrasonic transducer oscillates at the same calibration amplitude under similar conditions. The second bonding machine is designed to modify a second control signal based on electrical parameters from both calibration supplies, ultimately generating a modified second control signal to optimize the bonding process.
Career Highlights
Florian Eacock is currently employed at Infineon Technologies AG, where he continues to innovate in the field of ultrasonic bonding. His work has been instrumental in advancing the technology used in various applications, enhancing efficiency and precision in bonding processes.
Collaborations
Florian collaborates with talented colleagues, including Michal Chajneta and Stefan Tophinke. Their combined expertise contributes to the innovative environment at Infineon Technologies AG.
Conclusion
Florian Eacock's contributions to ultrasonic bonding technology exemplify the impact of innovation in engineering. His patented method for calibrating bonding machines showcases his commitment to advancing technology in this field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile